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3D Printer

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Laser Marking Machine

UV Laser Marking Machine Flying Laser Marking Machine CO2 Laser Marking Machine Visual (UV) Laser Marking Machine Fiber Laser Marking Machine

Laser Welding Machine

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Laser Cutting Machine

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Zhouzhuo -- opening new technologies and Applications

Using the new technology and patents of zhouzhuo, we can effectively, quickly and perfectly complete various experiments and production tasks, so that zhouzhuo can provide you with more professional products and services!

Product feedback and cooperation negotiation

If you have any problems and suggestions in the installation, use and maintenance of zhouzhuo products, please tell us quickly! You define our products!
About Us

Honor and Qualification

Customer Brands

We will provide you with technical support, cooperation negotiation and trial machine parts at any time.More contact information

Guangzhou Zhou Zhuo company：	Telephone：020-3119 9787	Fax：020-3119 9787
Shanghai Zhou Zhuo company：	Telephone：021-5109 8129	Fax：021-6085 1305
Chengdu Zhou Zhuo company：	Telephone：028-6153 3336	Fax：028-6153 3336
Beijing Office:	Telephone：139 1095 6496	Fax：010-6386 6076

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UV Laser Marking Machine

Advantage

1、Modular design, convenient maintenance, compact size

2、Environmental protection material, in line with ROHS standards

3、Cold light source, small processing heat effect, suitable for sensitive materials deep processing

4、Spot diameter of the minimum up to 15μM, suitable for thin sheet micro-hole drilling processing

5、20,000 hours of free maintenance, no supplies, energy saving

6、User-friendly software interface, easy to learn, powerful editing function

7、Narrower pulse width and higher peak power

8、Good processing effect, fast marking speed, ultra-fine laser marking achieved

Application

1、Suitable for glass, polymer materials and other objects surface marking, micro-hole processing;

2、Widely used in food, medicine, cosmetics, wires and other polymer materials of the packaging bottle (box) surface marking;

3、Flexible PCB board, LCD, TFT marking, slice cutting, etc.

4、Metal or non-metal coating removal;

5、Silicon wafer micro-hole, blind hole processing.

Submission of Cooperation Intention

Please Submit Your Requirements and We Will Contact You ASAP.